Process design kit leverages POI substrate for RF filters

Sawnics announced a process design kit (PDK) based on Soitec’s Connect piezo-on-insulator (POI) substrates to accelerate RF filter design for 5G smartphones. The South Korean foundry, with expertise in surface acoustic wave (SAW) filters, expects the Connect POI PDK will create new opportunities for the development and production of state-of-the-art 5G smartphone filters.

The PDK simplifies the development and production of filters built on Connect POI engineered substrates by reducing the number of design iterations, while meeting increasingly stringent 5G requirements. It also enables fabless companies to gain easier access to this RF filter technology.

Produced with Soitec’s Smart Cut layer transfer technology, Connect POI substrates are well-suited for the manufacture of new-generation SAW filters. Compared with technologies based on conventional materials, Connect POI products provide built-in temperature compensation, facilitate the integration of multiple filters on a single die, and help to reduce power consumption.

“Soitec’s Connect POI substrates were chosen for their unique value for RF filters,” said Jason Chung, vice president of Sawnics’ foundry business unit. “We are excited to work with Soitec’s substrates, which multiply filter performance when compared with filters built using bulk piezoelectric wafers. The volume production ramp on Connect POI products is expected to start in the second half of 2023.”



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